Lonza and Novoset launches thermoset polyimides for electronic and aerospace industries

Lonza and Novoset have introduced a new generation of thermoset polyimides. The new polyimides address shortcomings of conventional high temperature polyimides currently available in the market and will serve semiconductor packaging, aerospace, abrasives, composite tooling, electronics, and other industries.

Lonza is marketing these products worldwide in collaboration with Novoset under the Primaset trade name. The initial product, Primaset PPI-600, is now available in powdered and solvated form. Lonza and Novoset are working with selected customers to qualify this product for various leading-edge applications where long term thermo-oxidative stability and electric properties are critical. Furthermore, Lonza manufactures the key materials for this product.

Dr Josef Schröer, Head of Business Development, High Performance Materials, Lonza said, “We are excited to add this new product to our portfolio. We believe Primaset PPI-600 will prove essential for high reliability in a wide array of applications from aerospace to under-the-hood automotive electronics. Primaset PPI-600 warrants for dimensional stability which is crucial for the latest IC substrates for high-end electronic gadgets.”

Dr Sajal Das, Chief Executive Officer and President, Novoset said, “We are pleased to collaborate with Lonza on this unique product. The new polyimide can be used readily in solvent-based prepregs but unlike other products in the market, also in other liquid processes such as resin transfer molding (RTM), resin infusion, filament winding and hot/melt resin processes.”

Lonza has developed the new product group in close collaboration with Novosetand Cyalume Specialty Products, both based in New Jersey (US).

EP News Bureau