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COMSOL Conference 2014 calls for research papers

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The ProgramME Committee members of COMSOL Conference 2014, a premier event for multiphysics modeling and simulation are inviting engineers and researchers to submit abstracts to this year’s event. Selected papers, posters, and presentations will be featured at the 10th annual COMSOL Conference. This year, the conference will be held in Boston from October 8-10, 2014.

Presenting a poster, paper, or both at the COMSOL Conference is a great opportunity for multiphysics users to achieve widespread recognition within a skilled community of engineers and researchers.

“COMSOL users who present at the conference will have their work recognised and shared with more than 165,000 people. Engineers and scientists will have a unique chance to present in front of colleagues who are working through similar problems,” says Jinlan Huang, Program Chair for the Boston conference.

“Attendees can really benefit from sharing new simulation techniques and innovative design strategies.”

The highlights of the conference will be application-specific mini-course sessions taught by COMSOL specialists covering a wide array of disciplines; keynote talks from industry leaders and prominent researchers; an exhibition showcasing products offered by COMSOL Partners; the exciting introduction of the newest version of COMSOL Multiphysics; the chance to interact with peers and explore the simulation work of engineers.

Some of the suggested presentation topics include: AC/DC electromagnetics; acoustics and vibrations; batteries, fuel cells, and electrochemical processes; bioscience and bioengineering; chemical reaction engineering; computational fluid dynamics; electromagnetic heating; geophysics and geomechanics; heat transfer and phase change; MEMS and Nanotechnology; microfluidics; Multiphysics; optics, photonics, and semiconductors; optimisation and inverse methods; particle tracing; piezoelectric devices; plasma physics; RF and microwave engineering; simulation methods and teaching; structural mechanics and thermal stresses and transport phenomena.

Papers and posters presented at the conference will be published on the COMSOL website where they reach a worldwide audience of engineers.

EP News BureauMumbai

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